منابع مشابه
3D-Solenoid MEMS RF Inductor Design in Standard CMOS Technology
A new 3-D solenoid-inductor structure that is compatible with standard CMOS technology is proposed. Simulation shows excellent area efficiency of more than 80% saving over conventional planar spiral inductor. If combined with post-micromaching, a peak quality factor greater than 10 at 30GHz can be realized.
متن کاملA MEMS Tunable Inductor
This paper reports a single-wafer micromachined radiofrequency (RF) inductor that can be integrated in a conventional RFIC device. The inductor achieved a quality factor greater than 9 at 5Ghz and a self-resonance frequency well above 15 GHz. The inductor is tunable and the inductance variation is greater than 8%.
متن کاملFabrication of a Tunable RF MEMS Inductor on Silicon in a sub-150°C Process
One of the major challenges of successfully integrating radio frequency integrated circuits (RFIC) on silicon (Si) continues to be the poor performance of inductors. The low resistivity Si substrate is a cost-effective solution, however it is a major source of energy loss and limits the quality factor (Q) of inductors at high frequency. Conventional oxides introduce considerable stress due to t...
متن کاملPSO-Based Design of RF Integrated Inductor
This paper addresses an optimization-based approach for the design of RF integrated inductors. The methodology presented deals with the complexity of the design problem by formulating it as a multi-objective optimization. The multi-modal nature of the underlying functions combined with the need to be able to explore design trade-offs leads to the use of niching methods. This allows exploring no...
متن کاملRF MEMS Switches
An overview of the MEMS technology development and applications is given in this paper. A special attention is paid to the RF MEMS switches. Both series and shunt MEMS switches have been considered. It is also presented a technique for modeling and design of inductively-tuned MEMS shunt switch. Some very important issues for the device maturity e.g. reliability and packaging have been addressed.
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ژورنال
عنوان ژورنال: Procedia Engineering
سال: 2010
ISSN: 1877-7058
DOI: 10.1016/j.proeng.2010.09.372